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EN 2591-303-1997 航空航天系列.光电连接件.试验方法.第303部分:冷却/低压和湿热

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【英文标准名称】:Aerospaceseries-Elementsofelectricalandopticalconnection;testmethods-Part303:Cold/lowpressureanddampheat;GermanversionEN2591-303:1997
【原文标准名称】:航空航天系列.光电连接件.试验方法.第303部分:冷却/低压和湿热
【标准号】:EN2591-303-1997
【标准状态】:现行
【国别】:
【发布日期】:1997-12
【实施或试行日期】:
【发布单位】:欧洲标准学会(EN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:电连接器;环境试验;湿空气试验;英语;稳定性;气候试验;设备;湿热试验;大气压;热学;电力设备;电离;长期性状;温度;试验条件;多语种的;潮气;德语;电的;电气元件;航空航天运输;低温试验;湿度;稳定性试验;环境条件;气候;航空运输;航天运输;试验持续时间;飞行器部件;试验;电流;热试验;测量;紧固件
【英文主题词】:Aerospacetransport;Airtransport;Aircraftcomponents;Atmosphericpressure;Climate;Climatictests;Coldness;Damp-airtests;Damp-heattests;Electricconnectors;Electriccurrent;Electrical;Electricalcomponents;Electricalinstallations;Englishlanguage;Environmentalcondition;Environmentaltesting;Equipment;Fasteners;Germanlanguage;Heat;Humid;Humidity;Ionization;Long-timebehaviour;Measurement;Moisture;Multilingual;Opticalelements;Spacetransport;Stability;Stabilitytests;Temperature;Testduration;Testing;Testingconditions;Thermaltest
【摘要】:
【中国标准分类号】:V27
【国际标准分类号】:49_060
【页数】:7P.;A4
【正文语种】:英语


Product Code:SAE AMS6544
Title:Plate, Maraging Steel 2.0cr 10ni 8.0co 1.0mo (0.10-0.14c) Double Vacuum Melted, Solution Heat Treated
Issuing Committee:Ams E Carbon And Low Alloy Steels Committee
Scope:This specification covers a maraging steel in the form of rolled or forged plate. This product has been used typically for heat treated parts requiring a combination of high strength, toughness, and weldability, but usage is not limited to such applications.Product Code:SAE J1211
Title:Handbook for Robustness Validation of Automotive Electrical/Electronic Modules
Issuing Committee:Automotive Electronic Systems Reliability Standards
Scope:SCOPEThis document addresses robustness of electrical/electronic modules for use in automotive applications. Where practical,methods of extrinsic reliability detection and prevention will also be addressed. This document primarily deals withelectrical/electronic modules (EEMs), but can easily be adapted for use on mechatronics, sensors, actuators andswitches. EEM qualification is the main scope of this document. Other procedures addressing random failures arespecifically addressed in the CPI (Component Process Interaction) section 10. This document is to be used within thecontext of the Zero Defect concept for component manufacturing and product use.It is recommended that the robustness of semiconductor devices and other components used in the EEM be assuredusing SAE J1879 OCT2007, Handbook for Robustness Validation of Semiconductor Devices in Automotive Applications.The emphasis of this document is on hardware and manufacturing failure mechanisms, however, other contemporaryissues as shown in Figure 1 need to be addressed for a thorough Robustness Validation. A Pareto of contemporaryissues is shown in Figure 1. Although this document addresses many of the issues shown, however some are outsidethe scope of this document and will need to be addressed for a thorough RV process application. Examples of issuesoutside the scope of this document are system interactions, interfaces, functionality, HMI (Human-Machine Interface) andsoftware. At the time of publication of this handbook, a system level Robustness Validation handbook, which addressesthese issues, had been initiated.