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【英文标准名称】:Standardforhandling,packing,shippinganduseofmoisture/reflowsensitivesurfacemountdevices
【原文标准名称】:对湿敏/逆流敏表面安装器件的处置、包装、发货和使用的标准
【标准号】:IEC/PAS62169-2000
【标准状态】:作废
【国别】:国际
【发布日期】:2000-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:电气工程;抗湿;搬运;表面安装;电子设备及元件;航运;电子工程;包装件;半导体器件;表面安装设备
【英文主题词】:Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Handling;Moistureresistance;Packages;Semiconductordevices;Shipping;SMD;Surfacemounting
【摘要】:3.1Packages3.1.1ThisstandardappliestoallnonhermeticSMDssubjectedtobulksolderreflowprocessesduringPCBassembly,includingplasticencapsulatedpackagesandallotherpackagesmadewithmoisture-permeablepolymericmaterials(epoxies,silicones,etc.)thatareexposedtotheambientair.3.1.2Hermeticcomponentsarenotatriskanddonotrequiremoistureprecautionaryhandling.3.2Assemblyprocesses3.2.1Thisstandardappliestobulksolderreflowassemblybyconvection,convection/IR,infrared(IR),andvaporphasereflow(VPR)processes.Itdoesnotapplytobulksolderreflowprocessesthatimmersethecomponentbodiesinmoltensolder(e.g.,backsidewavesolder).SuchprocessesarenotallowedformanySMDsandarenotcoveredbythecomponentqualificationsstandardsusedasabasisforthisdocument.3.2.2Thisstandardalsoappliestomoisturesensitivecomponentsthatareremovedorattachedsinglybylocalambientheating,i.e.,"hotairrework."3.2.3Thisstandarddoesnotapplytocomponentsthataresocketedandnotexposedtosolderreflowtemperatures.Suchcomponentsarenotatriskanddonotrequiremoistureprecautionaryhandling.3.2.4Thisstandarddoesnotapplytocomponentsinwhichonlytheleadsareheatedtoreflowthesolder,e.g.,hand-soldering,hotbarattachofgullwingleads,andpin-thru-holewithbacksidewavesolder.Theheatabsorbedbythepackagebodyfromsuchoperationsistypicallymuchlowerthanforbulksurfacemountrefloworhotairrework,andmoistureprecautionarymeasuresaretypicallynotneeded.3.3Reliability3.3.1Themethodssetforthinthisspecificationensurethatadequatecomponentreliability,asevaluatedandverifiedbyJ-STD-020and/orbyJESD22-A113plusenvironmentalreliabilitytesting,ismaintainedduringandafterthePCBassemblyoperation.3.3.2Thisspecificationdoesnotaddressorensuresolderjointreliabilityofattachedcomponents.
【中国标准分类号】:L08
【国际标准分类号】:31_080_01
【页数】:14P.;A4
【正文语种】:英语


【英文标准名称】:Harmonizedsystemofqualityassessmentforelectroniccomponents-Familyspecification:single-modedispersionunshifted(B1.1)opticalfibre
【原文标准名称】:电子元件用质量保证的协调体系.类规范.单模式频散非移动光纤
【标准号】:BSEN188101-1995
【标准状态】:作废
【国别】:英国
【发布日期】:1995-10-15
【实施或试行日期】:1995-10-15
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:电子设备及元件;电子设备及元件;纤维光学;波长;质量保证体系;直径;波的性质和现象;光纤维;衰减;质量评估;规范(验收);频散
【英文主题词】:electronicequipmentandcomponents;specification;quality;opticalwaveguides;monomodefibres;dimensions;dispersion;familyspecification;testing;materialsspecification;specification(approval);glassfibrecables
【摘要】:
【中国标准分类号】:L00;M33
【国际标准分类号】:
【页数】:12P.;A4
【正文语种】:英语